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TH997-288-192-2.5

零件编号 TH997-288-192-2.5
产品分类 垫、床单
制造商 Penchem Technologies Sdn Bhd
描述 THERM PAD 288MMX192MM BLUE
封装
包装 床单
数量 20
RoHS 状态 YES
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$23.9400

$23.9400

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产品参数
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类型描述
制造商Penchem Technologies Sdn Bhd
系列TH997
包装床单
产品状态ACTIVE
颜色Blue
材料Silicone
形状Rectangular
厚度0.0984" (2.500mm)
类型Gap Filler Pad, Sheet
用法Thermally Conductive
大纲288.00mm x 192.00mm
导热系数2.4W/m-K
粘合剂Tacky - Both Sides

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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