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WCBLF227L2031

零件编号 WCBLF227L2031
产品分类 焊接
制造商 Canfield Technologies
描述 BLF 227 WATER SOLUBLE FLUX 8 OZ
封装
包装 线轴
数量 49
RoHS 状态 YES
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$36.9495

$36.9495

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产品参数
类型描述
制造商Canfield Technologies
系列-
包装线轴
产品状态ACTIVE
直径0.031" (0.79mm)
线规20 AWG, 22 SWG
作品BLF 227 (99.17Sn/.8Cu/.03Ni)
类型Wire Solder
熔点440°F (227°C)
形式Spool, 8 oz (227g), 1/2 lb
过程Lead Free
助焊剂类型Water Soluble
储存/冷藏温度50°F ~ 104°F (10°C ~ 40°C)
保质期开始Date of Manufacture
保质期24 Months

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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