86-13826519287‬
取消

XR700

零件编号 XR700
产品分类 配件
制造商 Productech
描述 TREBLAB XR700 PRO Wireless Runni
封装
包装 零售包装
数量 30
RoHS 状态 NO
分享
库存:
总数

数量

价格

总价

1

$41.9685

$41.9685

获取报价信息
产品参数
类型描述
制造商Productech
系列-
包装零售包装
产品状态ACTIVE
颜色Black
与/相关产品一起使用Mobile Devices
配件类型Earbuds
替代型号
XR7002KW
新锐-XNRUSEMI
N-MOSFETS
XR700SJ32T
新锐-XNRUSEMI
N-MOSFETS
相似型号
XR70P03
新锐-XNRUSEMI
P-MOSFETS
XR70N03F
新锐-XNRUSEMI
N-MOSFETS
XR70P03F
新锐-XNRUSEMI
P-MOSFETS
XR70P03D
新锐-XNRUSEMI
P-MOSFETS
XR7002KW
新锐-XNRUSEMI
N-MOSFETS
XR700SJ32T
新锐-XNRUSEMI
N-MOSFETS
CXR702F080
索尼-Sony
CMOS 32-bit Single Chip Microcomputer
CXR704060
索尼-Sony
CMOS 32-bit Single Chip Microcomputer
CXR702080
索尼-Sony
CMOS 32-bit Single Chip Microcomputer
GMA05XR70J153MA01#
村田-Murata
Wire Bonding Mount Multilayer Microchip Capacitors for General Purpose
GMA05XR70J153KA01#
村田-Murata
Wire Bonding Mount Multilayer Microchip Capacitors for General Purpose
GMA05XR70J103MA01#
村田-Murata
Wire Bonding Mount Multilayer Microchip Capacitors for General Purpose
GMA05XR70J103KA01#
村田-Murata
Wire Bonding Mount Multilayer Microchip Capacitors for General Purpose
GMA05XR70J682KA01#
村田-Murata
Wire Bonding Mount Multilayer Microchip Capacitors for General Purpose
GMA05XR70J223KA01#
村田-Murata
Wire Bonding Mount Multilayer Microchip Capacitors for General Purpose
GMA05XR70J223MA01#
村田-Murata
Wire Bonding Mount Multilayer Microchip Capacitors for General Purpose
GMA05XR70J682MA01#
村田-Murata
Wire Bonding Mount Multilayer Microchip Capacitors for General Purpose

Panasonic Electronic Components
RES SMD 1.1K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 2.4K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 1.5K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 3K OHM 5% 1/8W 0805
Roving Networks (Microchip Technology)
IC EEPROM 1KBIT MICROWIRE 8SOIC
Omron Electronic Components
SENSOR OPT REFLECTIVE 5MM 5DIP
Sullins Connector Solutions
CONN HEADER VERT 1POS
Sullins Connector Solutions
CONN HEADER VERT 1POS
关闭
Inquiry
captcha

86-13826519287‬
0